IS 576

Product features

Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Material SR25
Inner diameter / mm: 3.1
Diameter / mm: 7.0
Outer diameter / mm: 3.9
Thickness / mm: 0.4
Insulation capacity: 15.0

Insulating bush in combination with insulating wafers from mica or silicone foil facilitate insulated mounting of semiconductors to heat sinks or other components

Product pictures

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