SI 481

Product features

Semiconductor casing: TO-3
Semiconductor mounted by: Screw
Material Silicon w. Glasfibre
Thickness / mm: 0.23
Insulation capacity: 2.0

Glass fiber reinforced silicone foil in combination with bushes facilitate insulated mounting of semiconductors e.g. on heatsinks. They are highly flexible and ensure optimal heat conductivity even without using thermal compounds. - Thickness: 0,23mm - Dielectric strength: app. 5 KV - Dielectric constant: 2,29 (by 10^6 Hz) - Hardness: (Test ASTM D 2240) 85 Shore A - Elongation: (Test ASTM D 412) 2% - Colour: grey - Tolerance: +/-0,02mm - Temperature range: -60 / +200 °C - Thermal Conductivity: 0,9 W / mK - UL listed

Product pictures

1 / 1
5857_1_Titel style=
5857_1_Titel