Product featuresSemiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Min. thermal resistance / K/W: 1.0
Thickness / mm: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0
Insulation wafer - silicone (Glass fibre reinforced) self-adhesive on one side, for clip mounting facilitate insulated mounting of semiconductors, e.g. to heatsinks. They are highly flexible and ensure optimal heat conductivity even without using thermal compounds.