SI 6018-S

Product features

Semiconductor casing: TO-220
Semiconductor mounted by: Clip Mounting ; Bonding
Material Silicon w. Glasfibre
Thickness / mm: 0.18
Insulation capacity: 2.0
Dielectric coefficient 2.0

Glass fibre reinforced silicone foil in combination with insulating bushes facilitate insulated mounting of semiconductors e.g. on heatsinks. They are highly flexible and ensure optimal heat conductivity even without using thermal compounds. - self-adhesive on one side - Colour: grey - Hardness: (Test ASTM D 2240) 85 Shore A - Elongation: (Test ASTM D 412) 2% - Tolerance: +/- 0,02 mm - Temperatur range: -60 / +200 °C - Thermal Conductivity: 0,9 W / mK - UL listed - Thickness: 0,18 mm - Rth: 0,33 K/W - Dielectric strength: app. 4 KV - Dielectric constant: 2,56 (at 10^6 Hz)

Product pictures

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